ICP carrier
Silicon carbide ICP carrier plate is formed by isostatic pressing process and sintered at high temperature. Can also be set according to the user
The drawing requires that the outer diameter, thickness, number and size of acupuncture points, the position and shape of the slot be refined
To meet the specific requirements of users.
- Typical application
- Features and advantages
- Specification
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Typical application
ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing, that is, inductively coupled plasma etching.
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Features and advantages
Good thermal conductivity, low expansion coefficient and temperature equalization performance
Resistance to plasma impact
Can be made according to the specific size requirements of customers, the maximum diameter can reach 495MM
Resistant to various strong acid and alkali chemical reagents -
Specification
